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Are you a student planning to pursue postgraduate training? Or a trainee seeking an entry-level position? If so, attend ACCP’s Professional Placement Forum, to be held during the 2018 ACCP Global Conference in Seattle, Washington.

Three opportunities are available for you to meet with hiring representatives:

  • Residency and Fellowship Positions, Session I, 8:00 a.m.-9:30 a.m
  • Residency and Fellowship Positions, Session II, 10:00 a.m.-11:30 a.m.
  • Practitioner or Faculty Positions, 1:30 p.m.-3:00 p.m.

During the session, you will have the opportunity to:

  • Meet one-on-one with preceptors, program directors, and administrators seeking candidates
  • Learn more and ask questions about each program or opening
  • Submit an early bid for these highly coveted positions
  • Submit your resume or CV online for hiring representatives to view ahead of time

Making Your Way through the Professional Placement Forum

You can participate in the Professional Placement Forum in three easy steps:

Step 1: Register for the 2018 Global Conference.Indicate that you wish to participate in the Professional Placement Forum by checking the appropriate boxes on your meeting registration form. There is no additional fee to participate in the forum, but applicants must be registered for no less than a 1-day registration for Sunday, October 21, of the Global Conference. Already registered? E-mail and request to have the Professional Placement Forum added to your registration.

Step 2: Post your applicant profile online.This very important step gives employers a chance to familiarize themselves with interested candidates. The applicant profile gives you the opportunity to summarize who you are, which positions you are pursuing, and your qualifications. Providing your contact information will also allow employers to contact you before the Forum.

Step 3: Search Online Positions to see a list of positions and the detailed descriptions, application deadlines, and other important information.

Professional Placement Forum Resources

Additional Resources


Questions? E-mail